Nonvolatile memory device and method for fabricating the same

ABSTRACT

A nonvolatile memory device includes gate structures formed over a substrate, each gate structure including a tunnel insulating layer, a floating gate, an inter-gate dielectric layer, and a control gate that are sequentially stacked, a protective layer formed on sidewalls of the floating gate, and a second insulating layer covering the gate structures and having an air gap formed between the gate structures, wherein an adhesive strength between the second insulating layer and the protective layer is smaller than an adhesive strength between the second insulating layer and the gate structure.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims priority of Korean Patent Application No.10-2012-0096722, filed on Aug. 31, 2012, which is incorporated herein byreference in its entirety.

BACKGROUND

1. Field

Exemplary embodiments of the present invention relate to a nonvolatilememory device and a method for fabricating the same, and moreparticularly, to a nonvolatile memory device including an air gap formedbetween gate structures and a method for fabricating the same.

2. Description of the Related Art

A nonvolatile memory device maintains data stored therein even thoughpower supply is cut off. For example, a NAND flash memory device and thelike are widely used.

A conventional memory device includes a plurality of gate structureseach having a tunnel insulating layer, a floating gate, an inter-gatedielectric layer, and a control gate which are sequentially stacked.Typically, the floating gate is formed of polysilicon doped withimpurities.

However, while a subsequent process is performed after the gatestructures are formed, the impurities of the floating gate may not bemaintained. For example, the impurities of the floating gate may escapeduring a subsequent heat treatment, or impurities may be implanted intothe floating gate during a subsequent ion implantation. As such, whenthe impurities of the floating gate are changed, memory cells may havenon-uniform characteristics. In this case, a distribution differencebetween memory cells may increase.

Recently, as the distance between gate structures decreases with theincrease in integration degree of nonvolatile memory devices,interference between memory cells has increased.

SUMMARY

Exemplary embodiments of the present invention are directed to anonvolatile memory device capable of reducing a distribution differenceand interference between memory cells and a method for fabricating thesame.

In accordance with an embodiment of the present invention, a nonvolatilememory device includes gate structures formed over a substrate, eachgate structure including a tunnel insulating layer, a floating gate, aninter-gate dielectric layer, and a control gate that are sequentiallystacked, a protective layer formed on sidewalls of the floating gate,and a second insulating layer covering the gate structures and having anair gap formed between the gate structures, wherein an adhesive strengthbetween the second insulating layer and the protective layer is smallerthan an adhesive strength between the second insulating layer and thegate structure.

In accordance with another embodiment of the present invention, anonvolatile memory device includes a gate structure formed over asubstrate and including a tunnel insulating layer, a floating gate, aninter-gate dielectric layer, and a control gate that are sequentiallystacked, and a protective layer formed on sidewalls of the floating gateconfigured to block impurities from being transferred from or to thefloating gate.

In accordance with yet another embodiment of the present invention, amethod for fabricating a nonvolatile memory device includes sequentiallyforming a tunnel insulating layer, a first conductive layer for afloating gate, an inter-gate dielectric layer, and a second conductivelayer for a control gate over a substrate, forming gate structures overthe substrate, each gate structure formed by etching the secondconductive layer, the inter-gate dielectric layer, and the firstconductive layer, and forming a protective layer pattern on at leastsidewalls of the etched first conductive layer, the protective layerpattern blocking impurities from being transferred from or to thefloating gate.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view illustrating a nonvolatile memory device inaccordance with an embodiment of the present invention.

FIGS. 2 to 6 are cross-sectional views illustrating the nonvolatilememory device and a method for fabricating the same in accordance withthe embodiment of the present invention.

FIG. 7 is a cross-sectional view illustrating a nonvolatile memorydevice and a method for fabricating the same in accordance with anotherembodiment of the present invention.

DETAILED DESCRIPTION

Exemplary embodiments of the present invention will be described belowin more detail with reference to the accompanying drawings. The presentinvention may, however, be embodied in different forms and should not beconstrued as limited to the embodiments set forth herein. Rather, theseembodiments are provided so that this disclosure will be thorough andcomplete, and will fully convey the scope of the present invention tothose skilled in the art. Throughout the disclosure, like referencenumerals refer to like parts throughout the various figures andembodiments of the present invention. In this specification,‘connected/coupled’ represents that one component is directly coupled toanother component or indirectly coupled through another component. Inaddition, a singular form may include a plural form as long as it is notspecifically mentioned in a sentence.

The drawings are not necessarily to scale and in some instances,proportions may have been exaggerated in order to dearly illustratefeatures of the embodiments. It should be readily understood that themeaning of “on” and “over” in the present disclosure should beinterpreted in the broadest manner such that “on” not only means“directly on” something but also include the meaning of “on” somethingwith an intermediate feature or a layer therebetween, and that “over”not only means the meaning of “over” something may also include themeaning it is “over” something with no intermediate feature or layertherebetween (i.e., directly on something).

FIG. 1 is a plan view illustrating a nonvolatile memory device inaccordance with an embodiment of the present invention.

Referring to FIG. 1, a plurality of active areas ACT are defined in asubstrate. The plurality of active areas ACT are arranged in parallel toeach other and extended in one direction (I-I′ direction). Over thesubstrate, a plurality of control gates CG are formed. The plurality ofcontrol gates CG are arranged in parallel to each other and extended ina direction crossing the active areas ACT. Between the control gates CGand the active areas ACT, a plurality of island-shaped floating gates FGare formed at the respective intersections between the control gates CGand the active areas ACT. Between the floating gates FG and thesubstrate, a tunnel insulating layer (not illustrated) is interposed,and between the floating gates FG and the control gates FG, aninter-gate dielectric layer (not illustrated) is interposed. Each of thefloating gates FG forms a unit memory cell MC as a charge storingelement. Hereinafter a structure in which the tunnel insulating layer,the floating gate FG, the inter-gate dielectric layer, and the controlgate CG, which are sequentially stacked, will be referred to as a gatestructure.

FIGS. 2 to 6 are cross-sectional views illustrating the nonvolatilememory device and a method for fabricating the same in accordance withthe embodiment of the present invention, taken along line of FIG. 1.First, the fabrication method will be described.

Referring to FIG. 2, a structure in which a tunnel insulating layer 11and a floating-gate conductive layer 12 are stacked is formed over asubstrate 10.

Such a structure may be formed by the following process. First, aninsulating material for forming the tunnel insulating layer 11 and aconductive material for forming the floating-gate conductive layer 12are deposited on the entire surface of the substrate 10. Then, a maskpattern is formed over the conductive material to cover active areas ACT(refer to FIG. 1). The mask pattern serving as an etch barrier is usedto etch the conductive material and the insulating material. Then, thesubstrate 10 exposed by the etch process is etched to a predetermineddepth to form an isolation trench in the substrate 10, thereby definingan active area. Subsequently, the isolation trench is filled with aninsulating layer to form an isolation layer (not illustrated). As aresult of this process, the tunnel insulating layer 11 and thefloating-gate conductive layer 12 may have substantially the same planshape as the active area of the substrate 10.

The substrate 10 may include a semiconductor substrate such as silicon.The tunnel insulating layer 11 for charge tunneling between thesubstrate 10 and a floating gate may include oxide, for example. Thefloating-gate conductive layer 12 serves as a charge storing element,and may include a semiconductor material doped with a required impuritysuch as phosphorus or boron, for example, polysilicon. However, thepresent invention is not limited thereto.

Subsequently, an insulating material for forming inter-gate dielectriclayers 13 and a conductive material for forming control-gate conductivelayers 14 are deposited on the resulting structure, and then selectivelyetched to form a plurality of control-gate conductive layers 14 andinter-gate dielectric layers 13 that extend in a direction crossing theactive areas of the substrate 10. As a result of this process, thecontrol-gate conductive layers 14 may have substantially the same planshape as the control gates CG of FIG. 1.

The inter-gate dielectric layer 13 serves to block charge transferbetween the floating-gate conductive layer 12 and the control-gateconductive layer 14, and may include a triple layer structure such asoxide-nitride-oxide (ONO) layer. However, the present invention is notlimited thereto. The control-gate conductive layer 14 may includeimpurity-doped polysilicon, for example, but the present invention isnot limited thereto.

Then, a first insulating layer 15 is formed on the surface of thecontrol-gate conductive layer 14. The first insulating layer 15 servesnot only to protect the control-gate conductive layer 14 during asubsequent etch process for the floating-gate conductive layer 12, butalso to prevent a protective layer from being formed on the surface ofthe control-gate conducive layer 14 during a formation process of theprotective layer (refer to reference numeral 16 of FIG. 3), because thefirst insulating layer 15 has a poor adhesion characteristic withrespect to the protective layer. The first insulating layer 15 mayinclude oxide, and may be formed by a dry oxidation process or an atomiclayer deposition (ALD) process, but the present invention is not limitedthereto.

Referring to FIG. 3, the floating-gate conductive layer exposed by thecontrol-gate conductive layer 14 and the first insulating layer 15 isetched. As a result, a floating gate 12′ having an island shape isformed at a position where the control-gate conductive layer 14 and theactive area overlap each other.

Then, a protective layer 16 is formed on the sidewalls of the floatinggate 12′ to prevent impurities from escaping from the floating gate 12′or impurities from being implanted into the floating gate 12′. At thistime, the protective layer 16 may include a material capable of blockingtransfer of impurities and having a low adhesive strength with respectto a second insulating layer to be described below (refer to referencenumeral 18 of FIG. 6). When the second insulating layer includes oxide,the protective layer 16 may include germanium (Ge). Since the protectivelayer 16 does not adhere to the first insulating layer 15 on the surfaceof the control-gate conductive layer 14, the protective layer 16 is notformed on the control-gate conductive layer 14, but formed on thesidewalls of the floating gate 12′ and the tunnel insulating layer 11.Furthermore, when the adhesion characteristic between the protectivelayer 16 and the tunnel insulating layer 11 is degraded, for example,when the tunnel insulating layer includes oxide and the protective layer16 includes Ge, the protective layer 16 may be formed only on thesidewalls of the floating gate 12′, but may not be formed on the tunnelinsulating layer 11.

The protective layer 16 may be formed by ALD, for example, and may havea thickness of several Å.

Referring to FIG. 4, the protective layer 16 on the tunnel insulatinglayer 11 is removed to form a protective layer pattern 16′ left only onthe sidewalls of the floating gate 12′. This process is performed toform a junction area in the active area of the substrate 10 between thefloating gates 12′ and to electrically isolate the floating gates 12′from each other. The removal process of the protective layer 16 may beperformed by a dry-etch process.

When the protective layer 16 is not formed on the tunnel insulatinglayer 11, for example, when the protective layer 16 includes Ge and thetunnel insulating layer 11 includes oxide, the process of FIG. 4 may beomitted.

Then, although not illustrated, an ion implantation of impurities suchas B or As may be performed to form a junction area in the active areaof the substrate 10 between the floating gates 12′. During the ionimplantation, since the sidewalls of the floating gate 12′ are coveredby the protective layer pattern 16′, the impurities such as B or As maynot be implanted into the floating gate 12′. Furthermore, although asubsequent heat treatment process or the like is performed, theimpurities of the floating gate 12′ may not escape to the outside.

Referring to FIG. 5, the first insulating layer 15 is removed, and asilicide process is performed to transform an upper part of thecontrol-gate conductive layer 14 into a metal silicide layer 17 such asnickel silicide or cobalt silicide, in order to reduce the resistance ofthe control-gate conductive layer 14. Accordingly, the control-gateconductive layer 14 and the metal silicide layer 17 may form a controlgate. The silicide process may be omitted.

As a result of this process, a gate structure P is formed, including thetunnel insulating layer 11, the floating gate 12′, the inter-gatedielectric layer 13, and the control gate 14 and 17 that aresequentially stacked.

Referring to FIG. 6, a second insulating layer 18 is formed on thestructure shown in FIG. 5.

The second insulating layer 18 may include oxide, for example. If thesecond insulating layer 18 is formed to degrade a step coveragecharacteristic, for example, if the second insulating layer 18 isdeposited by a low pressure (LP) or plasma enhanced (PE) method, thespace between the gate structures P may not be filled with an insulatingmaterial. In this case, air gaps G1 and G2 may be formed between thegate structures P. Hereinafter, for convenience of description, the airgap G2 disposed between the adjacent control gates 14 and 17 is referredto as an upper air gap G2, and the air gap G1 disposed between theadjacent floating gates 12′ is referred to as a lower air gap G1.

Here, in order to prevent interference between memory cells, the size ofthe air gaps G1 and G2 may be increased. In particular, the size of thelower air gap G1 between the floating gates 12 needs to be increased. Asdescribed above, however, the protective layer 16 on the sidewalls ofthe floating gate IT has a small adhesive strength with respect to thesecond insulating layer 18. Therefore, the second insulating layer 18 isnot formed on the sidewall of the floating gate 12′. Furthermore, theadhesive strength between the second insulating layer 18 and theinter-gate dielectric layer 13 or the control gate 14 and 17, which isnot covered by the protective layer 16, is larger than the adhesivestrength between the second insulating layer 18 and the protective layer16. Therefore, the second insulating layer 18 may exist at apredetermined thickness on the sidewalls of the inter-gate dielectriclayer 13 and/or the control gate 14 and 17. Since the protective layer16 has a small thickness of several A as described above, the protectivelayer 16 does not have an effect on the size of the lower air gap G1. Asa result, the size of the lower air gap G1 between the floating gates12′ may increase.

Through the above-described fabrication method, the device of FIG. 6 maybe fabricated.

Referring to FIG. 6, the gate structure P including the tunnelinsulating layer 11, the floating gate 12′, the inter-gate dielectriclayer 13, and the control gate 14 and 17, which are sequentiallystacked, is disposed over the substrate 10.

Over the substrate 10 having the gate structure P formed thereon, thesecond insulating layer 18 is disposed to cover the gate structure P. Atthis time, since the second insulating layer 18 has a poor step coveragecharacteristic, the air gaps G1 and G2 are formed between the gatestructures P inside the second insulating layer 18.

On the sidewalls of the floating gate 12′, the protective layer pattern16′ is formed to prevent impurity transfer of the floating gate 12′. Theprotective layer pattern 16′ has a poor adhesion characteristic withrespect to the second insulating layer 18. Therefore, since the secondinsulating layer 18 is not formed on the protective layer pattern 16′,the lower air gap G1 and the protective layer pattern 16′ may bedirectly contacted with each other. As a result, the size of the lowerair gap G1 between the floating gates 12′ may be increased.

In the nonvolatile memory device and the method for fabricating the samein accordance with the embodiment of the present invention, the materialforming the protective layer pattern 16′ may be properly controlledduring the process for forming the protective layer pattern 16′ on thesidewalls of the floating gate 12′, thereby preventing impurity transferof the floating gate 12′ and increasing the size of the air gap betweenthe floating gates 12′. As a result, a distribution difference betweenmemory cells and interference between memory cells may be reduced.

In this embodiment of the present invention, the protective layerpattern 16′ exists on the sidewalls of the floating gate 12′ of the gatestructure P, but the present invention is not limited thereto. Theprotective layer pattern 16′ may also be formed on the other part of thegate structure P excluding the floating gate 12′. Hereinafter, thestructure will be described in more detail with reference to FIG. 7.

FIG. 7 is a cross-sectional view illustrating a nonvolatile memorydevice and a method for fabricating the same in accordance with anotherembodiment of the present invention.

First, the fabrication method will be described, and the duplicateddescriptions of the above-described embodiment will be omitted herein.

Referring to FIG. 7, a gate structure P′ including a tunnel insulatinglayer 110, a floating gate 120, an inter-gate dielectric layer 130, anda control gate 140, which are sequentially stacked, is formed over asubstrate 100.

The gate structure P′ may be formed by the following process: the etchprocess for forming the inter-gate dielectric layer 13 and thecontrol-gate conductive layer 14 in the process of FIG. 2 is performedand the floating-gate conductive layer 12 is then etched without theprocess for forming the first insulating layer 15. That is, the floatinggate 120, the inter-gate dielectric layer 130, and the control gate 140may be formed by one etch process using the same mask.

Then, a protective layer pattern 160 having a small adhesive strengthwith respect to the second insulating layer 180 is formed on thesidewalls of the gate structure P′ to prevent impurity transfer. Theprotective layer pattern 160 may be formed by depositing a protectivelayer along the entire surface of the resulting structure having thegate structure P′ formed therein and then performing a dry-etch processto expose the tunnel insulating layer 110. During the dry-etch processfor the tunnel insulating layer 110, the protective layer deposited onthe top surface of the gate structure P′ may be removed. Accordingly,the top surface of the gate structure P′ may be exposed.

Subsequently, a second insulating layer 180 is formed on the resultingstructure having the gate structure P′ and the protective layer pattern160 formed therein. In this case, since the protective layer pattern 160having a poor adhesion characteristic with respect to the secondinsulating layer 180 is positioned on the sidewalls of the gatestructure P′, the second insulating layer 180 may be mainly formed overthe gate structure P′, and air gaps G1′ and G2′ may be positioned in theentire space between the gate structures P′ to expose the protectivepattern 160. Although not illustrated, a process for silicidizing anupper part of the control gate 140 may be additionally performed beforethe second insulating layer 180 is formed.

Through the above-described fabrication method, the device of FIG. 7 maybe fabricated.

Referring to FIG. 7, the device in accordance with this embodiment ofthe present invention is different from the above-described embodimentin that the protective layer pattern 160 is positioned on the entiresidewalls of the gate structure P′ including the floating gate 120.

In short, the protective layer pattern 160 is formed on the sidewalls ofthe floating gate 120, in order to prevent impurity transfer of thefloating gate 120 and prevent interference between the floating gates120. However, the protective layer pattern 160 may or may not be formedon the other part of the gate structure In this embodiment of thepresent invention, the protective layer pattern 160 may be formed on theentire sidewalls of the gate structure P′. However, the protective layerpattern 160 may be formed on a part of the sidewalls of the gatestructure P′, or formed on a part or all of the top surface of the gatestructure P′.

In accordance with the embodiment of the present invention, adistribution difference and interference between memory cells may bereduced.

While the present invention has been described with respect to thespecific embodiments, it will be apparent to those skilled in the artthat various changes and modifications may be made without departingfrom the spirit and scope of the invention as defined in the followingclaims.

1-9. (canceled)
 10. A method for fabricating a nonvolatile memorydevice, comprising: sequentially forming a tunnel insulating layer, afirst conductive layer for a floating gate, an inter-gate dielectriclayer, and a second conductive layer for a control gate over asubstrate; forming gate structures over the substrate, each gatestructure formed by etching the second conductive layer, the inter-gatedielectric layer, and the first conductive layer; and forming aprotective layer pattern on at least sidewalls of the etched firstconductive layer, the protective layer pattern blocking impurities frombeing transferred from or to the floating gate.
 11. The method of claim10, further comprising forming a first insulating layer on the surfaceof the etched second conductive layer, after the second conductive layeris etched.
 12. The method of claim 11, wherein an adhesive strengthbetween the first insulating layer and the protective layer pattern issmaller than an adhesive strength between the protective layer patternand the first conductive layer.
 13. The method of claim 11, wherein thetwilling of the first insulating layer is performed by a dry-oxidationprocess or atomic layer deposition (ALD) process.
 14. The method ofclaim 10, wherein the forming of the protective layer pattern comprises:forming a protective layer on sidewalls of the etched first conductivelayer and the tunnel insulating layer; and removing the protective layeron the tunnel insulating layer through a dry-etch process.
 15. Themethod of claim 10, wherein the protective layer pattern is furtherformed on a part or all of the gate structure excluding the etched firstconductive layer.
 16. The method of claim 10, wherein an adhesivestrength between the tunnel insulating layer and the protective layerpattern is smaller than an adhesive strength between the protectivelayer pattern and the first conductive layer.
 17. The method of claim10, wherein the protective layer pattern comprises Ge.
 18. The method ofclaim 11, further comprising removing the first insulating layer, afterthe forming of the protective layer pattern.
 19. The method of claim 11,wherein the first insulating layer or the tunnel insulating layercomprises oxide.
 20. The method of claim 10, further comprising forminga second insulating layer covering the gate structures and having an airgap formed between the gate structures, after the forming of theprotective layer patterns.
 21. The method of claim 20, wherein anadhesive strength between the second insulating layer and the protectivelayer patterns is smaller than an adhesive strength between the secondinsulating layer and the second conductive layer or an adhesive strengthbetween the second insulating layer and the inter-gate dielectric layer.22. The method of claim 20, wherein the second insulating layercomprises oxide.